Novel Bonding technologies for wafer-level transparent packaging of MOEMS

Packaging costs of Micro-Electro-Mechanical System (MEMS) are still contributing with >50% to the total costs of most devices. Aligned wafer bonding techniques for Wafer-level packaging (WLP) demonstrates a huge potential to reduce these costs due to a smaller size of the total package, improved performance and shorter time to market. A special group of MEMS devices, Micro-OptoElectro-Mechanical Systems (MOEMS), enjoys the potential to account for almost one third of the total MEMS sales by 2010, mainly driven by Digital Mirror Devices (DMD). MOEMS packages do require optical transparency at the operating wavelength of the individual sensors and actuators in addition to the conventional MEMS packaging requirements. This paper presents well understood wafer bonding and bond alignment technologies as well as high-volume proven equipment solutions for next generation transparent WLP of MOEMS.